Siemens EDA is a global technology leader in electronic design automation software. Our software tools enable companies around the world to develop new and highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics in order to deliver better products in the increasingly complex world of chip, board and system design. Overview. Siemens EDA, is seeking a senior level, self-starting, motivated, and hard workin...
Siemens
EDA is a global technology leader in electronic design automation
software. Our software tools enable
companies around the world to develop new and highly innovative electronic
products faster and more cost-effectively. Our customers use our tools to push the
boundaries of technology and physics in order to deliver better products in the
increasingly complex world of chip, board and system design.
Overview
Siemens
EDA, is seeking a senior level, self-starting, motivated, and hard working
individual for an opportunity to serve as a chiplet design lead in our 3D IC
Solutions Engineering team in driving the development of comprehensive, end to
end workflow solutions supporting the development of advanced 2.5 and 3D System
in Package (SIP) designs. These multi-domain workflow solutions seamlessly integrate
Siemens’ industry leading EDA and MCAD tools that facilitate the architectural
planning, physical design/verification, muti-die based electrical, thermal,
mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package
(SIP) designs.
The
primary responsibility for this position is in developing scripts and workflows
to support the planning, integration and verification of chiplet IC designs
into a 2.5/3D IC package designs. An additional responsibility is to work with
the 3D IC Solutions package design lead and place and route engineering team to
develop an integrated silicon interposer physical design and verification flow.
Additional responsibilities include providing technical support in the
development and integration of design/reliability analysis workflows including
IR Drop, Electromigration Analysis (EM), package and silicon interface level
Timing Analysis & Signal Integrity Analysis.
Reference
designs and test structures and/or customer designs will be used in the
development, testing and validation of these workflows. The chiplet design lead
will also provide technical support and guidance to the sales, marketing design
service organizations as required.
This
position may require periodic travel to work with customers in developing and
validating these workflow solutions.
Requirements
BS
or MS in Electrical/Computer Engineering:
- 10 or more years
of Physical IC design experience including:
o
Place
and Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (IC/3DIC/Custom
Compiler), Cadence (SoC Encounter, Innovus, Virtuoso)
o
Physical
Verification: DRC, LVS, IR/EM analysis
o
Integration
and validation of Silicon-on-Chip (SOC) IP integration and validation
- Working knowledge
of IC tools and design methods including:
o
RTL
Design/Verification, Logic Syntheses, LEC, STA analysis
o
DFT
integration and ATE test support a plus
- Working knowledge
of Advanced Packaging EDA tools and design methods including:
o
2.5D
and 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)
o
Package
Design Cadence (APD/SiP), Siemens (XSI/XPD)
o
Signal/Power
integrity analysis: Siemens (HyperLynx SI/PI), Ansys (Redhawk, Totem, Swave),
Cadence (Sigrity, Clarity)
- Detailed knowledge
of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.).
- Working OS
knowledge of Windows and Linux
- Scripting/Programming: Python, Tcl, Perl, or similar languages
required; Tk based GUI development is a plus.
- Working knowledge
of Thermal/Mechanical stress analysis and/or optical design IC EDA tools
and design methods including a plus:
o
Thermal
and/or mechanical stress analysis tools: Siemens (NX, Flowtherm, SimCenter 3D),
Ansys (Icepak, Mechanical), Cadence (Celsius)
o
Optical
design/analysis tools: Siemens (Tanner), Ansys (Lumerical)
- Working competency
with Microsoft Word, Excel, and PowerPoint.
Why us?
Working at Siemens Software means flexibility - Choosing between
working at home and the office at other times is the norm here. We offer great
benefits and rewards, as you'd expect from a world leader in industrial
software.
A collection of over 377,000 minds building the future, one day at
a time in over 200 countries. We're dedicated to equality, and we welcome
applications that reflect the diversity of the communities we work in. All
employment decisions at Siemens are based on qualifications, merit, and
business need. Bring your curiosity and creativity and help us shape tomorrow!
Siemens Software. Transform the Everyday
The salary range for this position is $145,700 to
$262,300. The actual
compensation offered is based on the successful candidate’s work location as
well as additional factors, including job-related skills, experience, and
relevant education/training. Siemens
offers a variety of health and wellness benefits to employees. Details
regarding our benefits can be found here: www.benefitsquickstart.com. In addition, this position is eligible
for time off in accordance with Company policies, including paid sick leave,
paid parental leave, PTO (for non-exempt employees) or non-accrued flexible
vacation (for exempt employees).
#LI-EDA
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