Siemens
EDA is a global technology leader in electronic design automation
software. Our software tools enable
companies around the world to develop new and highly innovative electronic
products faster and more cost-effectively.
Our customers use our tools to push the boundaries of technology and
physics in order to deliver better products in the increasingly complex world
of chip, board and system design.
Job
Overview
Siemens
EDA is seeking a senior level, self-starting, motivated, and high performing
individual for an opportunity to serve as the package design lead in our 3D IC
Solutions Engineering team in driving the development of comprehensive, end to
end workflow solutions supporting the development of advanced 2.5 and 3D System
in Package (SIP) designs. These multi-domain workflow solutions seamlessly integrate
Siemens’ industry leading EDA and MCAD tools that facilitate the architectural
planning, physical design/verification, muti-die based electrical, thermal,
mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package
(SIP) designs.
The
primary responsibility for this position will be to drive the development of
workflows to support the physical design planning, layout, and verification of
advanced 3D IC designs. These workflows include package floor planning, package/chiplet
level functional/ IO planning, interposer/substrate planning, layout, package
level connectivity, Logical Equivalence Checking (LEC), package level 3Dstack
(DRC/LVS) verification and physical DRC/DFM verification of the package
components (excluding the chiplet devices). Additional responsibilities include
working with the 3D IC Solutions teams in integrating the other 3D IC workflows
into the 3D IC Physical Design workflow.
Reference
designs and test structures and/or customer designs will be used in the
development, testing and validation of these workflows. The package design lead
will also provide technical support and guidance to the sales, marketing design
service organizations as required.
This
position may require periodic travel to work with customers in developing and
validating these workflow solutions.
Requirements
·
BS
or MS in Electrical/Computer Engineering
- 10 or more years
of advanced package physical design and verification experience
- Working knowledge
(3-5 years of experience preferred) of Advanced Packaging IC EDA tools and
design methods including:
o
2.5D
and 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)
o
Package
Design Cadence (APD/SiP), Siemens (XSI/XPD)
o
Signal/Power
integrity analysis: Siemens (HyperLynx SI/PI), Ansys (Redhawk, Totem, Swave),
Cadence (Sigrity, Clarity)
- Detailed knowledge
of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.).
- Working OS
knowledge of Windows and Linux
- Scripting/Programming: Python, Tcl, Perl, or similar languages
required; Tk based GUI development is a plus.
- Working knowledge
of IC EDA tools and design methods including:
o
ASIC
design methodology from RTL Synthesis to Physical Implementation phases
o
RTL
Design/Verification, LEC, STA analysis
o
Integration
and validation of Silicon-on-Chip IP integration and validation
o
Place
and Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (IC/3DIC/Custom
Compiler), Cadence (SoC Encounter, Innovus, Virtuoso)
o
Physical
Verification: DRC, LVS, IR/EM analysis
o
DFT
integration and ATE test support.
- Working knowledge
of Thermal/Stress analysis and/or optical design tools and design methods a
plus, including:
o
Thermal
and/or mechanical stress analysis tools: Siemens (NX, Flowtherm, SimCenter 3D),
Ansys (Icepak, Mechanical), Cadence (Celsius)
o
Optical
design/analysis tools: Siemens (Tanner), Ansys (Lumerical)
- Working competency
with Microsoft Word, Excel, and PowerPoint.
Why us?
Working at Siemens Software means flexibility - Choosing between
working at home and the office at other times is the norm here. We offer great
benefits and rewards, as you'd expect from a world leader in industrial
software.
A collection of over 377,000 minds building the future, one day at
a time in over 200 countries. We're dedicated to equality, and we welcome
applications that reflect the diversity of the communities we work in. All
employment decisions at Siemens are based on qualifications, merit, and
business need. Bring your curiosity and creativity and help us shape tomorrow!
Siemens Software. Transform the Everyday
The salary range for this position is $145,700 to $262,300. The
actual compensation offered is based on the successful candidate’s work
location as well as additional factors, including job-related skills,
experience, and relevant education/training. Siemens offers a
variety of health and wellness benefits to employees. Details regarding our benefits
can be found here: www.benefitsquickstart.com.
In addition, this position is eligible for time off in accordance with Company
policies, including paid sick leave, paid parental leave, PTO (for non-exempt
employees) or non-accrued flexible vacation (for exempt employees).
#LI-EDA
#LI-HYBRID
#LI-PS1