Siemens EDA is a global technology leader in electronic design automation software. Our software tools enable companies around the world to develop new and highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics in order to deliver better products in the increasingly complex world of chip, board and system design. Job Overview. Siemens EDA is seeking a senior level, self-starting, motivated, and hard-wor...
Siemens
EDA is a global technology leader in electronic design automation
software. Our software tools enable
companies around the world to develop new and highly innovative electronic
products faster and more cost-effectively.
Our customers use our tools to push the boundaries of technology and
physics in order to deliver better products in the increasingly complex world
of chip, board and system design.
Job
Overview
Siemens
EDA is seeking a senior level, self-starting, motivated, and hard-working
individual for an opportunity to serve as a senior thermal/stress analysis lead
in our 3D IC Solutions Engineering team in driving the development of
comprehensive, end to end workflow solutions supporting the development of
advanced 2.5 and 3D System in Package (SIP) designs. These multi-domain workflow
solutions seamlessly integrate Siemens’ industry leading EDA and MCAD tools that
facilitate the architectural planning, physical design/verification, muti-die
based electrical, thermal, mechanical stress analysis and manufacturing test of
advanced 2.5 and 3D System-in-Package (SIP) designs.
The
primary responsibility for this position is in developing workflows and
methodologies to support the thermal and thermal-mechanical stress analysis of 2.5/3D
IC package designs. This analysis leverages several Siemens thermal and
stress/reliability analysis tools and requires the identification of
potentially new tools and methods to develop a best in class toolkit.. These
workflows will support predictive analysis during the architectural planning
and analysis phase, in-design analysis during the physical design phase and
signoff to manufacturing handoff analysis. Additional support for mechanical tolerance
and sensitivity analysis is also offer for design that include custom mechanical
package/lid/stiffener designs and/or thermal heat sink designs. The thermal and
stress analysis workflows will also include support for true 3D stacked die
designs.
Reference
designs and test structures and/or customer designs will be used in the
development, testing and validation of these workflows. The thermal/stress
analysis lead will work closely with potential customers and academic knowledge
hubs. Their responsibilities will include gathering requirements from existing
and potential customers / partners and communicate these to the respective
product management organizations within Siemens DISW. The ideal candidate will
have the ability to work horizontally in the organization and influence
multiple product management/product development teams without direct authority.
The thermal/stress lead will also provide technical support and guidance to the
sales, marketing design service organizations as required.
This
position may require periodic travel to work with customers in developing and
validating these workflow solutions.
Requirements
- BS
or MS in Electrical/Computer Engineering
- 10+ years of
experience and working knowledge of Thermal/Mechanical stress analysis,
test and/or optical design IC EDA tools and design methods including
o
Thermal
and/or mechanical stress analysis tools: Siemens (NX, Flotherm, Simcenter 3D,
T3Ster), Ansys (Icepak, Mechanical), Cadence (Celsius)
- Optical
design/analysis tools: Siemens (Tanner), Ansys (Lumerical)Working
experience in semiconductor package thermal management techniques,
methods and best practices
- Understanding of
semiconductor package thermal and reliability requirements and test
procedures
- Prior experience
in product management / product development / NPI is a plus
- Prior experience
in technical marketing / sales is a plus
·
Additional
understanding of general Physical IC design and/or IC packaging tools and
concepts is favorable, including:
o
Place
and Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (IC/3DIC/Custom
Compiler), Cadence (SoC Encounter, Innovus, Virtuoso)
o
Physical
Verification: DRC, LVS, IR/EM analysis
o
Integration
and validation of Silicon-on-Chip (SOC) IP integration and validation
- Working knowledge
of IC tools and design methods including:
o
RTL
Design/Verification, Logic Syntheses, LEC, STA analysis
o
DFT
integration and ATE test support a plus
- Working knowledge
of Advanced Packaging EDA tools and design methods including:
o
2.5D
and 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)
o
Package
Design Cadence (APD/SiP), Siemens (XSI/XPD)
o
Signal/Power
integrity analysis: Siemens (HyperLynx SI/PI), Ansys (Redhawk, Totem, Swave),
Cadence (Sigrity, Clarity)
- Detailed knowledge
of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.).
- Working OS
knowledge of Windows and Linux
- Scripting/Programming: Python, Tcl, Perl, or similar languages
required; Tk based GUI development is a plus.
- Working competency
with Microsoft Word, Excel, and PowerPoint.
Why us?
Working at Siemens Software means flexibility - Choosing between
working at home and the office at other times is the norm here. We offer great
benefits and rewards, as you'd expect from a world leader in industrial
software.
A collection of over 377,000 minds building the future, one day at
a time in over 200 countries. We're dedicated to equality, and we welcome
applications that reflect the diversity of the communities we work in. All
employment decisions at Siemens are based on qualifications, merit, and
business need. Bring your curiosity and creativity and help us shape tomorrow!
Siemens Software. Transform the Everyday
The salary range for this position is $145,700 to $262,300. The actual compensation offered is based on the successful candidate’s work location as well as additional factors, including job-related skills, experience, and relevant education/training. Siemens offers a variety of health and wellness benefits to employees. Details regarding our benefits can be found here: www.benefitsquickstart.com. In addition, this position is eligible for time off in accordance with Company policies, including paid sick leave, paid parental leave, PTO (for non-exempt employees) or non-accrued flexible vacation (for exempt employees).
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