Siemens EDA is a global technology leader in electronic design automation software. Our software tools enable companies around the world to develop new and highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics in order to deliver better products in the increasingly complex world of chip, board and system design. Overview. Siemens EDA, is seeking a senior level, self-starting, motivated, and hard workin... more details
SiemensEDA is a global technology leader in electronic design automationsoftware. Our software tools enablecompanies around the world to develop new and highly innovative electronicproducts faster and more cost-effectively. Our customers use our tools to push theboundaries of technology and physics in order to deliver better products in theincreasingly complex world of chip, board and system design.
Overview
SiemensEDA, is seeking a senior level, self-starting, motivated, and hard workingindividual for an opportunity to serve as a chiplet design lead in our 3D ICSolutions Engineering team in driving the development of comprehensive, end toend workflow solutions supporting the development of advanced 2.5 and 3D Systemin Package (SIP) designs. These multi-domain workflow solutions seamlessly integrateSiemens’ industry leading EDA and MCAD tools that facilitate the architecturalplanning, physical design/verification, muti-die based electrical, thermal,mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package(SIP) designs.
Theprimary responsibility for this position is in developing scripts and workflowsto support the planning, integration and verification of chiplet IC designsinto a 2.5/3D IC package designs. An additional responsibility is to work withthe 3D IC Solutions package design lead and place and route engineering team todevelop an integrated silicon interposer physical design and verification flow.Additional responsibilities include providing technical support in thedevelopment and integration of design/reliability analysis workflows includingIR Drop, Electromigration Analysis (EM), package and silicon interface levelTiming Analysis & Signal Integrity Analysis.
Referencedesigns and test structures and/or customer designs will be used in thedevelopment, testing and validation of these workflows. The chiplet design leadwill also provide technical support and guidance to the sales, marketing designservice organizations as required.
Thisposition may require periodic travel to work with customers in developing andvalidating these workflow solutions.
Requirements
BSor MS in Electrical/Computer Engineering:
- 10 or more years of Physical IC design experience including:
o Placeand Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (IC/3DIC/CustomCompiler), Cadence (SoC Encounter, Innovus, Virtuoso)
o PhysicalVerification: DRC, LVS, IR/EM analysis
o Integrationand validation of Silicon-on-Chip (SOC) IP integration and validation
- Working knowledge of IC tools and design methods including:
o RTLDesign/Verification, Logic Syntheses, LEC, STA analysis
o DFTintegration and ATE test support a plus
- Working knowledge of Advanced Packaging EDA tools and design methods including:
o 2.5Dand 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)
o PackageDesign Cadence (APD/SiP), Siemens (XSI/XPD)
o Signal/Powerintegrity analysis: Siemens (HyperLynx SI/PI), Ansys (Redhawk, Totem, Swave),Cadence (Sigrity, Clarity)
- Detailed knowledge of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.).
- Working OS knowledge of Windows and Linux
- Scripting/Programming: Python, Tcl, Perl, or similar languages required; Tk based GUI development is a plus.
- Working knowledge of Thermal/Mechanical stress analysis and/or optical design IC EDA tools and design methods including a plus:
o Thermaland/or mechanical stress analysis tools: Siemens (NX, Flowtherm, SimCenter 3D),Ansys (Icepak, Mechanical), Cadence (Celsius)
o Opticaldesign/analysis tools: Siemens (Tanner), Ansys (Lumerical)
- Working competency with Microsoft Word, Excel, and PowerPoint.
Why us?
Working at Siemens Software means flexibility - Choosing betweenworking at home and the office at other times is the norm here. We offer greatbenefits and rewards, as you'd expect from a world leader in industrialsoftware.
A collection of over 377,000 minds building the future, one day ata time in over 200 countries. We're dedicated to equality, and we welcomeapplications that reflect the diversity of the communities we work in. Allemployment decisions at Siemens are based on qualifications, merit, andbusiness need. Bring your curiosity and creativity and help us shape tomorrow!
Siemens Software. Transform the Everyday
The salary range for this position is $145,700 to$262,300. The actualcompensation offered is based on the successful candidate’s work location aswell as additional factors, including job-related skills, experience, andrelevant education/training. Siemensoffers a variety of health and wellness benefits to employees. Detailsregarding our benefits can be found here: www.benefitsquickstart.com. In addition, this position is eligiblefor time off in accordance with Company policies, including paid sick leave,paid parental leave, PTO (for non-exempt employees) or non-accrued flexiblevacation (for exempt employees).
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