DESCRIPTION
The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire a Hardware Development Engineer with experience in semiconductor process development and a particular chip bonding, 3D integration, Systems on Chip and Systems in Package who will aid in AWSs effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group, you will solve problems related to the fabrication and characterization of novel quantum processors.
Key job responsibilities
Responsibilities include developing, improving and sustaining fabrication and packaging processes; analyzing inline metrology and electrical test data; interacting with project leads to provide feedback that continuously improves the process. Candidates must have a demonstrated background in sound engineering principles, and must have superlative data analysis, problem solving, and communication skills. Successful candidates will have experience in wire-bonding, flip chip bonding, SoC and SiP techniques and tools. Working effectively within a team environment is critical.
A day in the life
The candidate will spend most of the day in a cleanroom environment, in a protective suit performing hands-on packaging tasks using IC packaging equipment. The candidate will carry out packaging steps for quantum computing product chips, as well as for development projects.
About the team
A fabrication/packaging team within AWS Center for Quantum computing is responsible for delivering quantum computing product chips and implementing groundbreaking process innovations.
We are open to hiring candidates to work out of one of the following locations:
Pasadena, CA, USA
BASIC QUALIFICATIONS
- BS in physics, applied physics, material science, electrical engineering or related field
- 2+ years of relevant industry experience (or equivalent lab experience in an MS or PhD program)
- Expertise in one or more of the following lithography processes and tools: Flip chip bonding tools, wafer bonding tools, SoC and SiP techniques.
PREFERRED QUALIFICATIONS
- MS or higher in physics, applied physics, materials science, electrical engineering or related field
- Good working knowledge in two or more of the following device fabrication areas: MEMS, photo lithography, metal/dielectric/silicon etching, metal/dielectric thin film deposition, epitaxy, CMP, plating processes, process integration, and electron/ion/x-ray/scanning probe characterization tools
- Great problem solving and analytical skills
- Communication and data presentation skills
- Basic programming skills (e.g. Python, Julia, MATLAB)
- Experience or knowledge in superconducting microwave devices or superconducting qubits is a plus
Amazon is committed to a diverse and inclusive workplace. Amazon is an equal opportunity employer and does not discriminate on the basis of race, national origin, gender, gender identity, sexual orientation, protected veteran status, disability, age, or other legally protected status. For individuals with disabilities who would like to request an accommodation, please visit https://www.amazon.jobs/en/disability/us.
Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $93,900/year in our lowest geographic market up to $185,000/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on job-related knowledge, skills, and experience. Amazon is a total compensation company. Dependent on the position offered, equity, sign-on payments, and other forms of compensation may be provided as part of a total compensation package, in addition to a full range of medical, financial, and/or other benefits. For more information, please visit https://www.aboutamazon.com/workplace/employee-benefits. This position will remain posted until filled. Applicants should apply via our internal or external career site.
