As a quality and reliability engineering intern, you'll join a team developing leading edge semiconductor package technologies for Intel's latest products. Assembly/ Package reliability engineers take responsibility for setting reliability requirements to meet customer needs. We influence the design, material selection and process development of the new package technology to meet those needs. We use a wide variety of skills, from analytical models to advanced experimental designs to extensive da... more details
Job Details:
Job Description:
As a quality and reliability engineering intern, you'll join a team developing leading edge semiconductor package technologies for Intel's latest products. Assembly/Package reliability engineers take responsibility for setting reliability requirements to meet customer needs. We influence the design, material selection and process development of the new package technology to meet those needs. We use a wide variety of skills, from analytical models to advanced experimental designs to extensive data analysis, to evaluate and improve the package technology. Together with our technology development partners, we find the root cause of failure mechanisms and devise solutions.
Quality and reliability engineers are excellent data analyzers and analytical problem solvers in a high-paced, technically challenging environment. We measure our success by delivering world-class quality on cutting edge package technologies, faster and at a competitive cost.
This job might be for you, if:
- You like to find problems before they find you. You love taking on complex technical challenges and delivering robust solutions. You'll keep digging until you can explain the fundamental physics or chemistry behind the failure mechanism.
- You get a kick out of analyzing mounds of data and finding a pattern. You use data to drive decisions.
- You like working in a team to get results. You are persistent. You can keep others focused and aligned.
- Cool Responsibilities:
- Innovate analytical and experimental methods to validate package technology reliability.
- Automate package interconnect technology design, process and material capability analysis using AI/ML methods and deliver "smart" decision making tools to accelerate innovation.
- Deliver analysis results and impact to multiple levels within the quality and reliability community and business partners.
The ideal candidate should exhibit the following behavioral traits:
- Problem-solving skills
- Analytical skills
- Working in a dynamic, results and team-oriented environment
- High tolerance for ambiguity
- Strong written and verbal communication skills
- Influence, strategic thinking, and leadership skills.
- Demonstrated strength in technical and analytical problem solving.
- Clarity in communication skills: able to make the complex simple and understood by a wide audience.
- Experience in predictive scientific data analysis algorithms with focus on Artificial Intelligence/Machine Learning
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
- Pursuing M.S. or Ph.D. in Materials Science, Mechanical Engineering, Physics or Chemistry. Electrical Engineering, Aerospace Engineering and Chemical Engineering candidates will also be considered, if they have relevant coursework or experience.
- 1+ years of Python experience.
Preferred qualifications:
- Experience in data science and database management systems
- Experience in empirical data collection and statistical data analysis, reliability statistics, and design of experiments.
- Well organized, discipline and ability to manage tasks and time to ensure that business needs are met.
Job Type:
Student / Intern
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, California, Los Angeles, US, California, Santa Clara, US, Georgia, Atlanta, US, Massachusetts, Chelmsford, US, Massachusetts, Marblehead, US, Michigan, Detroit, US, Texas, Austin
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html
Annual Salary Range for jobs which could be performed in
US, California:
Salary range dependent on a number of factors including location and experience.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
