Job Abstract

Increasing responsibility for operating, programming, and troubleshoot processes using Datacon die placement and K&S wire bonding equipment. Increasing responsibility for operating, programming, and troubleshoot processes using dispense equipment for underfill, epoxy fill, and glob top operations. Bond pull operation and measurements. Performs engineering specified modifications to programs. Assurance that quality requirements are met through in process checks and inspections. Maintain and sign ... more details

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