Job Abstract

Job Description

At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.

Our teams are currently hiring for a broad range of experience levels including: Microelectronics Test Engineers?(Associate, Mid-Level, or Senior). This position will be based out of Huntington Beach, CA.

Within BR&T, Boeing’s Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems.  We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state of the art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification, packaging and test) in house.  SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers, and is nationally recognized in aerospace microelectronics design communities. SSED’s large staff of microelectronics engineers conduct research, design, and test microelectronics hardware in support of these projects.

SSED executes a variety of exciting, technically challenging projects, offering endless opportunities to develop depth and breadth of technical skills.  We offer long-term potential for career growth into both technical leadership and/or management positions and seek curiosity, creativity, innovation, attention to detail, clear communication, and the ability to understand and meet customer needs. 

We are seeking an experienced engineer to lead our microelectronics cryogenic test activities, develop innovative strategies to improve and grow the test capability of our group, and capture new business from internal and external sources.  SSED tests custom-designed microelectronics, ranging from characterization test chips to SoCs to integrated chip sets, including bring up and debug, electrical testing, performance characterization, reliability stresses, radiation testing, and characterization across extreme environments.  SSED is expanding our cryogenic test capabilities, including facilities, capital equipment, and test processes, across multiple sites.

We are Boeing Research & Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace.  We are engineers and technicians, skilled scientists and bold innovators; Join us and put your passion, determination, and skill to work building the future!   #TheFutureIsBuiltHere  #ChangeTheWorld

Position Responsibilities:

• Analyzes customer and system requirements to develop basic architectural approaches and detailed specifications for various electronic products.

• Develops high-level and detailed designs consistent with requirements and specifications.

• Validates designs through various methods of review, testing and

• analysis.

• Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements.

• Supports Supplier Management with make/buy recommendations and other technical services of limited scope.

• Provides engineering support throughout the lifecycle of the product.

• Investigates emerging technologies to develop concepts for future product designs to meet projected requirements.

• Works under general direction.

• Excellent verbal and written communication ability.

• Demonstrated track record as a self-motived, independent, high-performance team member.

This position is expected to be 100% onsite.  The selected candidate will be required to work onsite at the listed location.

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret Clearance Post-Start is required.

Basic Qualifications (Required Skills/Experience):

• Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science

• Experience in the design and test of integrated circuits

• Experience utilizing high-performance microelectronics test equipment (prober, power supply, oscilloscope, spectrum analyzer, network analyzer, etc.)

• Experience developing and implementing automated test strategies

• Experience leading teams or complex projects

Preferred Qualifications (Desired Skills/Experience):

• 5+ years work experience or an equivalent combination of education and experience 

• 10+ years of related work experience or an equivalent combination of education and experience

• Experience defining and overseeing lab construction to optimize capability and testing throughput based on current and future program requirements

• Experience with characterization and test of microelectronics for extreme environments (cryogenic and high temp, radiation, etc.)

• Experience with design-for-test strategies and circuit design

• Understanding of IC development flow and tools from device-level modelling and library development; chip-level requirements, architecture, design, and verification; foundry interface and fabrication; and final characterization and test.

• Experience working on large-scale SoC design teams

• Understanding of semiconductor device physics

• Understanding of commercial semiconductor fabrication process technologies, including standard CMOS, SOI, SiGe, and GaN.

• Experience supporting proposals (technical, cost, and schedule) with test strategies and plans

• Experience supporting military programs including engagement with customers

• Active security clearance

Typical Education/Experience:

Associate (Level 2):

Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 2 or more years' related work experience or an equivalent combination of technical education and experience (e.g. Master). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Mid-Level (Level 3):

Bachelor's degree and typically 5 or more years' experience in an engineering classification or a Master's degree with typically 3 or more years' experience in an engineering classification or a PhD degree with experience in an engineering classification. Bachelor, Master or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry. ABET is the preferred, although not required, accreditation standard.

Experienced (Level 4):

Bachelor's degree and typically 9 or more years' experience in an engineering classification or a Master's degree with typically 7 or more years' experience in an engineering classification or a PhD degree with typically 4 or more years' experience in an engineering classification. Bachelor, Master or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry. ABET is the preferred, although not required, accreditation standard.

Relocation:

This position offers relocation based on candidate eligibility.

Drug Free Workplace:

Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.

Shift Work Statement:

This position is for 1st shift.

At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent.  Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.  

The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.  

The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.

Pay is based upon candidate experience and qualifications, as well as market and business considerations. 

Summary pay range (Level 2): $86,850.00 – $116,150.00

Summary pay range (Level 3): $104,550.00 – $141,450.00

Summary pay range (Level 4): $126,650.00 – $171,350.00

BRT_MSA

Equal Opportunity Employer:

Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.