Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results! In this highly impactful role, you will initiate package concepts, own and drive sophisticated package selection, new product package structure and configuration optimization. You will be responsible for packaging integration and pack... more details
Do you like to work on groundbreaking technology? Have a passion for creating amazing products?Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results! In this highly impactful role, you will initiate package concepts, own and drive sophisticated package selection, new product package structure and configuration optimization. You will be responsible for packaging integration and package technology development for a variety of projects including SoC.
We are looking for an individual with experience working in the Semiconductor Packaging field.Knowledge in materials characterization and analysis. Ideal candidate will have proven understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology.General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers.Ability to work independently and orchestrate projects with minimum supervision.Solution-oriented engineer who has proven fundamentals in engineering physics. Shown capabilities using package design softwares, APD, Virtuoso, etc.Confirmed understanding in memory packaging.Good program management skills. BS and 3+ years of relevant industry experience.
- Packaging technology development including advanced 2.5D/3D packaging.- Work with multi-functional team and lead SoC Package integration efforts.- Package Architecture / Package Integration Innovation- Work with foundry and OSAT to bring packaging solution from concept to HVM.- Drive industry with sophisticated Package solutions, new material development, and specs.- 5% International travel.
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