Siemens EDA is a global technology leader in electronic design automation software. Our software tools enable companies around the world to develop new and highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics in order to deliver better products in the increasingly complex world of chip, board and system design. Job Overview. Siemens EDA is seeking a senior level, self-starting, motivated, and hard-wor... more details
SiemensEDA is a global technology leader in electronic design automationsoftware. Our software tools enablecompanies around the world to develop new and highly innovative electronicproducts faster and more cost-effectively. Our customers use our tools to push the boundaries of technology andphysics in order to deliver better products in the increasingly complex worldof chip, board and system design.
JobOverview
SiemensEDA is seeking a senior level, self-starting, motivated, and hard-workingindividual for an opportunity to serve as a senior thermal/stress analysis leadin our 3D IC Solutions Engineering team in driving the development ofcomprehensive, end to end workflow solutions supporting the development ofadvanced 2.5 and 3D System in Package (SIP) designs. These multi-domain workflowsolutions seamlessly integrate Siemens’ industry leading EDA and MCAD tools thatfacilitate the architectural planning, physical design/verification, muti-diebased electrical, thermal, mechanical stress analysis and manufacturing test ofadvanced 2.5 and 3D System-in-Package (SIP) designs.
Theprimary responsibility for this position is in developing workflows andmethodologies to support the thermal and thermal-mechanical stress analysis of 2.5/3DIC package designs. This analysis leverages several Siemens thermal andstress/reliability analysis tools and requires the identification ofpotentially new tools and methods to develop a best in class toolkit.. Theseworkflows will support predictive analysis during the architectural planningand analysis phase, in-design analysis during the physical design phase andsignoff to manufacturing handoff analysis. Additional support for mechanical toleranceand sensitivity analysis is also offer for design that include custom mechanicalpackage/lid/stiffener designs and/or thermal heat sink designs. The thermal andstress analysis workflows will also include support for true 3D stacked diedesigns.
Referencedesigns and test structures and/or customer designs will be used in thedevelopment, testing and validation of these workflows. The thermal/stressanalysis lead will work closely with potential customers and academic knowledgehubs. Their responsibilities will include gathering requirements from existingand potential customers / partners and communicate these to the respectiveproduct management organizations within Siemens DISW. The ideal candidate willhave the ability to work horizontally in the organization and influencemultiple product management/product development teams without direct authority.The thermal/stress lead will also provide technical support and guidance to thesales, marketing design service organizations as required.
Thisposition may require periodic travel to work with customers in developing andvalidating these workflow solutions.
Requirements
- BSor MS in Electrical/Computer Engineering
- 10+ years of experience and working knowledge of Thermal/Mechanical stress analysis, test and/or optical design IC EDA tools and design methods including
o Thermaland/or mechanical stress analysis tools: Siemens (NX, Flotherm, Simcenter 3D,T3Ster), Ansys (Icepak, Mechanical), Cadence (Celsius)
- Optical design/analysis tools: Siemens (Tanner), Ansys (Lumerical)Working experience in semiconductor package thermal management techniques, methods and best practices
- Understanding of semiconductor package thermal and reliability requirements and test procedures
- Prior experience in product management / product development / NPI is a plus
- Prior experience in technical marketing / sales is a plus
· Additionalunderstanding of general Physical IC design and/or IC packaging tools andconcepts is favorable, including:
o Placeand Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (IC/3DIC/CustomCompiler), Cadence (SoC Encounter, Innovus, Virtuoso)
o PhysicalVerification: DRC, LVS, IR/EM analysis
o Integrationand validation of Silicon-on-Chip (SOC) IP integration and validation
- Working knowledge of IC tools and design methods including:
o RTLDesign/Verification, Logic Syntheses, LEC, STA analysis
o DFTintegration and ATE test support a plus
- Working knowledge of Advanced Packaging EDA tools and design methods including:
o 2.5Dand 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)
o PackageDesign Cadence (APD/SiP), Siemens (XSI/XPD)
o Signal/Powerintegrity analysis: Siemens (HyperLynx SI/PI), Ansys (Redhawk, Totem, Swave),Cadence (Sigrity, Clarity)
- Detailed knowledge of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.).
- Working OS knowledge of Windows and Linux
- Scripting/Programming: Python, Tcl, Perl, or similar languages required; Tk based GUI development is a plus.
- Working competency with Microsoft Word, Excel, and PowerPoint.
Why us?
Working at Siemens Software means flexibility - Choosing betweenworking at home and the office at other times is the norm here. We offer greatbenefits and rewards, as you'd expect from a world leader in industrialsoftware.
A collection of over 377,000 minds building the future, one day ata time in over 200 countries. We're dedicated to equality, and we welcomeapplications that reflect the diversity of the communities we work in. Allemployment decisions at Siemens are based on qualifications, merit, andbusiness need. Bring your curiosity and creativity and help us shape tomorrow!
Siemens Software. Transform the Everyday
The salary range for this position is $145,700 to $262,300. The actual compensation offered is based on the successful candidate’s work location as well as additional factors, including job-related skills, experience, and relevant education/training. Siemens offers a variety of health and wellness benefits to employees. Details regarding our benefits can be found here: www.benefitsquickstart.com. In addition, this position is eligible for time off in accordance with Company policies, including paid sick leave, paid parental leave, PTO (for non-exempt employees) or non-accrued flexible vacation (for exempt employees).
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